

| Kipengele | Thamani |
|---|---|
| 0.2 mm² / flexible / > 10 N | |
| Dokezo | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Lami | 2.5 mm |
| Matokeo | Test passed |
| Mchakato | Reflow soldering |
| Upeo | 0.35 mm (10 Hz ... 60.1 Hz) |
| Kiwango cha ESD | (D) electrostatically conductive |
| Masafa | 10 - 150 - 10 Hz |
| Upana [w] | 22.6 mm |
| Urefu [h] | 9 mm |
| Urefu [l] | 7 mm |
| Mpangilio wa pini | Linear pad geometry |
| Kasi ya kufagia | 1 octave/min |
| Halijoto | 850 °C |
| Kuongeza kasi | 5g (60.1 Hz ... 150 Hz) |
| Jiometri ya pedi | 1.4 x 3.4 mm |
| Mstari wa bidhaa | COMBICON Terminals XS |
| Aina ya bidhaa | Printed circuit board terminal |
| Aina ya kupachika | SMD soldering |
| Vipimo | IEC 60998-2-2:2002-12 |
| Idadi ya safu mlalo | 1 |
| Familia ya bidhaa | PTSM 0,5/..-V-SMD |
| Upana wa tepi [W] | 44 mm |
| Rangi (Nyumba) | black (9005) |
| Maelekezo ya majaribio | X-, Y- and Z-axis |
| Marekebisho ya makala | 00 |
| Nyenzo ya mawasiliano | Cu alloy |
| Urefu uliowekwa | 9 mm |
| Urefu wa kukatwa | 6 mm |
| Muda wa kuambukizwa | 5 s |
| Mbinu ya muunganisho | Push-in spring connection |
| Aina ya kifungashio | 44 mm wide tape |
| [A] kipenyo cha koili | 330 mm |
| Mkondo wa nominella IN | 6 A |
| Volti ya kawaida ya Umoja wa Mataifa | 160 V |
| Mchoro wa vipimo | |
| Nyenzo za kuhami joto | LCP |
| Dokezo kwenye programu | Pick and place pads may protrude beyond the components. The PCB layout must ensure that collisions are avoided when components are assembled. |
| Idadi ya nafasi | 7 |
| Idadi ya uwezo | 7 |
| Aina ya kifungashio cha nje | Transparent-Bag |
| Volti iliyokadiriwa (II/2) | 160 V |
| Sehemu ya msalaba ya nominella | 0.5 mm² |
| Idadi ya miunganisho | 7 |
| Volti iliyokadiriwa (III/2) | 160 V |
| Volti iliyokadiriwa (III/3) | 32 V |
| Muda wa jaribio kwa kila mhimili | 2.5 h |
| Sifa za uso | hot-dip tin-plated |
| Kiwango cha Unyevu Kinachoathiriwa na Unyevu | MSL 1 |
| Rangi (Kipengele kinachoamilisha) | black (9005) |
| Kikundi cha nyenzo za kuhami joto | IIIa |
| Pini za solder kwa kila uwezo | 1 |
| CTI kulingana na IEC 60112 | 175 |
| Volti ya kuongezeka iliyokadiriwa (II/2) | 2.5 kV |
| Sehemu ya msalaba ya kondakta AWG | 26 ... 20 |
| Volti ya kuongezeka iliyokadiriwa (III/2) | 2.5 kV |
| Volti ya kuongezeka iliyokadiriwa (III/3) | 2.5 kV |
| Mizunguko ya solder katika mtiririko mpya | 3 |
| Kipimo cha jumla cha koili ya [W2] | 50.4 mm |
| Uainishaji wa halijoto Tc | 260 °C |
| Sehemu ngumu ya kondakta | 0.14 mm² ... 0.5 mm² |
| Halijoto ya kawaida (mkusanyiko) | -5 °C ... 100 °C |
| Halijoto ya mazingira (uendeshaji) | -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) |
| Volti ya insulation iliyokadiriwa (II/2) | 160 V |
| Sehemu ya msalaba ya kondakta inayonyumbulika | 0.2 mm² ... 0.5 mm² (up to 0.75 mm² supported, with a stripping length of 7.5 mm and a rated insulation voltage of 32 V at III/2) |
| Volti ya insulation iliyokadiriwa (III/2) | 160 V |
| Volti ya insulation iliyokadiriwa (III/3) | 32 V |
| umbali wa chini kabisa wa kuteleza (II/2) | 1.6 mm |
| Jaribio la kupanda kwa joto linalohitajika | Increase in temperature ≤ 45 K |
| umbali wa chini kabisa (III/2) | 1.6 mm |
| umbali wa chini kabisa (III/3) | 1.3 mm |
| Kipimo cha silinda cha ekseli / kipenyo | - / 1.2 mm |
| Unyevu wa jamaa (uhifadhi/usafiri) | 30 % ... 70 % |
| Ukadiriaji wa kuwaka kulingana na UL 94 | V0 |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Faharasa ya ufuatiliaji linganishi (IEC 60112) | CTI ≥175 to <400 |
| Eneo la kusugulia uso wa chuma (safu ya juu) | Tin (4 - 8 µm Sn) |
| Sehemu ya mwisho ya uso wa chuma (safu ya juu) | Tin (4 - 8 µm Sn) |
| Upinzani wa insulation, nafasi za jirani | > 5 MΩ |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (II/2) | 1.5 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/2) | 1.5 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/3) | 1.5 mm |
| Sehemu ya msalaba ya kondakta, inayonyumbulika, yenye kipete, na kifuniko cha plastiki | 0.25 mm² ... 0.34 mm² (possible from 0.14 mm², when using ferrule AI 0.14- 6 GY in combination with crimping pliers CRIMPFOX 10T-F) |
| Sehemu ya msalaba ya kondakta inayonyumbulika, yenye kipete bila kifuniko cha plastiki | 0.25 mm² ... 0.5 mm² |
| Sehemu mtambuka ya kondakta/aina ya kondakta/sehemu ya nguvu ya mvuto/thamani halisi | 0.14 mm² / solid / > 10 N |
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