

| Kipengele | Thamani |
|---|---|
| 0.14 mm² / flexible / > 10 N | |
| Dokezo | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Aina | PC termination block |
| Lami | 5.08 mm |
| Matokeo | Test passed |
| Upeo | 0.35 mm (10 Hz ... 60.1 Hz) |
| Masafa | 10 - 150 - 10 Hz |
| Upana [w] | 15.24 mm |
| Urefu [h] | 17.3 mm |
| Urefu [l] | 11.15 mm |
| Mpangilio wa pini | Linear pinning |
| Kasi ya kufagia | 1 octave/min |
| Halijoto | 850 °C |
| Kuongeza kasi | 5g (60.1 Hz ... 150 Hz) |
| Mstari wa bidhaa | COMBICON Terminals S |
| Aina ya bidhaa | Printed circuit board terminal |
| Kipenyo cha shimo | 1.3 mm |
| Aina ya kupachika | Wave soldering |
| Vipimo | IEC 60999-1:1999-11 |
| Idadi ya safu mlalo | 1 |
| Vipimo vya pini | 0.9 x 0.9 mm |
| Familia ya bidhaa | MKDSP 1,5 |
| Rangi (Nyumba) | blue (5015) |
| Maelekezo ya majaribio | X-, Y- and Z-axis |
| Marekebisho ya makala | 00 |
| Nyenzo ya mawasiliano | Cu alloy |
| Urefu uliowekwa | 13.8 mm |
| Urefu wa kukatwa | 7 mm |
| Muda wa kuambukizwa | 5 s |
| Mbinu ya muunganisho | Screw connection with tension sleeve |
| Kukaza torque | 0.5 Nm ... 0.6 Nm |
| Aina ya kifungashio | packed in cardboard |
| Mkondo wa nominella IN | 17.5 A |
| Volti ya kawaida ya Umoja wa Mataifa | 400 V |
| Mchoro wa vipimo | |
| Nyenzo za kuhami joto | PA |
| Dokezo kwenye programu | For safe conductor connection, always adhere to a defined tightening torque. Particularly in the case of PCB terminal blocks with two or three positions, the individual solder pin for each contact point cannot compensate for this. That is why the terminal blocks must be supported during conductor connection (held with one hand, support on the housing). |
| Idadi ya nafasi | 3 |
| Idadi ya uwezo | 3 |
| Volti iliyokadiriwa (II/2) | 630 V |
| Kichwa cha skrubu cha umbo la gari | Slotted (L) |
| Sehemu ya msalaba ya nominella | 1.5 mm² |
| Idadi ya miunganisho | 3 |
| Volti iliyokadiriwa (III/2) | 400 V |
| Volti iliyokadiriwa (III/3) | 250 V |
| Urefu wa pini ya solder [P] | 3.5 mm |
| Muda wa jaribio kwa kila mhimili | 2.5 h |
| Sifa za uso | Tin-plated |
| Kikundi cha nyenzo za kuhami joto | I |
| Pini za solder kwa kila uwezo | 1 |
| CTI kulingana na IEC 60112 | 600 |
| Volti ya kuongezeka iliyokadiriwa (II/2) | 4 kV |
| Sehemu ya msalaba ya kondakta AWG | 26 ... 14 |
| Volti ya kuongezeka iliyokadiriwa (III/2) | 4 kV |
| Volti ya kuongezeka iliyokadiriwa (III/3) | 4 kV |
| Sehemu ngumu ya kondakta | 0.14 mm² ... 2.5 mm² |
| Halijoto ya kawaida (mkusanyiko) | -5 °C ... 100 °C |
| Halijoto ya mazingira (uendeshaji) | -40 °C ... 105 °C (Depending on the current carrying capacity/derating curve) |
| Volti ya insulation iliyokadiriwa (II/2) | 630 V |
| Sehemu ya msalaba ya kondakta inayonyumbulika | 0.14 mm² ... 1.5 mm² |
| Dokezo kwenye sehemu ya muunganisho | With connected conductor 2.5 mm² (solid). |
| Volti ya insulation iliyokadiriwa (III/2) | 400 V |
| Volti ya insulation iliyokadiriwa (III/3) | 250 V |
| umbali wa chini kabisa wa kuteleza (II/2) | 3.2 mm |
| Jaribio la kupanda kwa joto linalohitajika | The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. |
| umbali wa chini kabisa (III/2) | 3 mm |
| umbali wa chini kabisa (III/3) | 3.2 mm |
| Unyevu wa jamaa (uhifadhi/usafiri) | 30 % ... 70 % |
| Ukadiriaji wa kuwaka kulingana na UL 94 | V2 |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Faharasa ya ufuatiliaji linganishi (IEC 60112) | CTI 600 |
| Eneo la kusugulia uso wa chuma (safu ya juu) | Tin (4 - 8 µm Sn) |
| Sehemu ya mwisho ya uso wa chuma (safu ya juu) | Tin (4 - 8 µm Sn) |
| Viendeshaji 2 vyenye sehemu sawa, imara | 0.14 mm² ... 1 mm² |
| Eneo la kusugulia uso wa chuma (safu ya kati) | Nickel (1.5 - 4 µm Ni) |
| Sehemu ya mwisho ya uso wa chuma (safu ya kati) | Nickel (1.5 - 4 µm Ni) |
| Upinzani wa insulation, nafasi za jirani | > 5 MΩ |
| Viendeshaji 2 vyenye sehemu sawa, vinavyonyumbulika | 0.14 mm² ... 0.75 mm² |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (II/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/3) | 3 mm |
| Sehemu ya msalaba ya kondakta, inayonyumbulika, yenye kipete, na kifuniko cha plastiki | 0.25 mm² ... 1.5 mm² |
| Sehemu ya msalaba ya kondakta inayonyumbulika, yenye kipete bila kifuniko cha plastiki | 0.25 mm² ... 1.5 mm² |
| Sehemu mtambuka ya kondakta/aina ya kondakta/sehemu ya nguvu ya mvuto/thamani halisi | 0.14 mm² / solid / > 10 N |
| Viendeshaji 2 vyenye sehemu sawa, vinavyonyumbulika, vyenye kipete bila sleeve ya plastiki | 0.25 mm² ... 0.5 mm² |
| Viendeshaji 2 vyenye sehemu sawa, vinavyonyumbulika, vyenye kipete TWIN chenye kifuniko cha plastiki | 0.5 mm² ... 1 mm² |
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