Kipatikana Bidhaa Maarufu
MC 1,5/ 9-G-3,81 P14 THRR56
MC 1,5/ 9-G-3,81 P14 THRR56 1702666 PHOENIX CONTACT Printed-circuit board connector
$0.00USD
4107 kwenye hisa
Vipimo Muhimu
Dokezo:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Aina:Component suitable for through hole reflow
Lami:3.81 mm
Matokeo:Test passed
Taarifa za Msambazaji
Bidhaa: 0
Kwa kawaida husafirisha ndani ya siku 2-3 za kazi
Ubora Umeheshimiwa
Usafirishaji wa haraka
Msaada wa Kiufundi
Speci ya Kiufundi
| Kipengele | Thamani |
|---|---|
| Dokezo | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Aina | Component suitable for through hole reflow |
| Lami | 3.81 mm |
| Matokeo | Test passed |
| Jumla | In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load. |
| Mchakato | Reflow/wave soldering |
| Rangi () | () |
| Upeo | 0.35 mm (10 Hz ... 60.1 Hz) |
| Masafa | 10 - 150 - 10 Hz |
| Upana [w] | 35.68 mm |
| Urefu [h] | 8.3 mm |
| Urefu [l] | 9.2 mm |
| Mpangilio wa pini | Linear pinning |
| Kasi ya kufagia | 1 octave/min |
| Kuongeza kasi | 5g (60.1 Hz ... 150 Hz) |
| Mstari wa bidhaa | COMBICON Connectors S |
| Aina ya bidhaa | PCB headers |
| Kipenyo cha shimo | 1.4 mm |
| Aina ya kupachika | THR soldering / wave soldering |
| Idadi ya mizunguko | 25 |
| Vipimo | IEC 60512-1-1:2002-02 |
| Idadi ya safu mlalo | 1 |
| Vipimo vya pini | 0.8 x 0.8 mm |
| Familia ya bidhaa | MC 1,5/..-G-THR |
| Mkazo wa joto | 100 °C/168 h |
| Upana wa tepi [W] | 56 mm |
| Flange ya kupachika | without |
| Maelekezo ya majaribio | X-, Y- and Z-axis |
| Marekebisho ya makala | 00 |
| Nyenzo ya mawasiliano | Cu alloy |
| Mkazo unaosababisha kutu | 0.2 dm3SO2on 300 dm3/40 °C/1 cycle |
| Urefu uliowekwa | 6.9 mm |
| Aina ya kifungashio | 56 mm wide tape |
| [A] kipenyo cha koili | 330 mm |
| Upinzani wa mguso | 1.4 mΩ |
| Mkondo wa nominella IN | 8 A |
| Volti ya kawaida ya Umoja wa Mataifa | 160 V |
| Mchoro wa vipimo | |
| Nyenzo za kuhami joto | LCP |
| Idadi ya nafasi | 9 |
| Idadi ya uwezo | 9 |
| Aina ya kifungashio cha nje | Transparent-Bag |
| Volti iliyokadiriwa (II/2) | 250 V |
| Upinzani wa mguso R1 | 1.4 mΩ |
| Upinzani wa mguso R2 | 1.5 mΩ |
| Idadi ya miunganisho | 9 |
| Volti iliyokadiriwa (III/2) | 160 V |
| Volti iliyokadiriwa (III/3) | 160 V |
| Urefu wa pini ya solder [P] | 1.4 mm |
| Muda wa jaribio kwa kila mhimili | 2.5 h |
| Sifa za uso | Tin-plated |
| Kiwango cha Unyevu Kinachoathiriwa na Unyevu | MSL 1 |
| Kikundi cha nyenzo za kuhami joto | IIIa |
| Pini za solder kwa kila uwezo | 1 |
| CTI kulingana na IEC 60112 | 175 |
| Volti ya kuongezeka iliyokadiriwa (II/2) | 2.5 kV |
| Idadi ya nafasi zilizojaribiwa | 20 |
| Mizunguko ya kuingiza/kutoa | 25 |
| Volti ya kuongezeka iliyokadiriwa (III/2) | 2.5 kV |
| Volti ya kuongezeka iliyokadiriwa (III/3) | 2.5 kV |
| Mizunguko ya solder katika mtiririko mpya | 3 |
| Kipimo cha jumla cha koili ya [W2] | 62.4 mm |
| Uainishaji wa halijoto Tc | 260 °C |
| Halijoto ya kawaida (mkusanyiko) | -5 °C ... 100 °C |
| Halijoto ya mazingira (uendeshaji) | -40 °C ... 100 °C (dependent on the derating curve) |
| Volti ya insulation iliyokadiriwa (II/2) | 250 V |
| Volti ya insulation iliyokadiriwa (III/2) | 160 V |
| Volti ya insulation iliyokadiriwa (III/3) | 160 V |
| umbali wa chini kabisa wa kuteleza (II/2) | 2.5 mm |
| Volti inayostahimili masafa ya nguvu | 1.39 kV |
| umbali wa chini kabisa (III/2) | 1.6 mm |
| umbali wa chini kabisa (III/3) | 2.5 mm |
| Punguza nguvu kwa kila pos. takriban. | 6 N |
| Nguvu ya kuingiza kwa kila nafasi ni takriban. | 8 N |
| Unyevu wa jamaa (uhifadhi/usafiri) | 30 % ... 70 % |
| Ukadiriaji wa kuwaka kulingana na UL 94 | V0 |
| Msukumo hustahimili volteji katika usawa wa bahari | 2.95 kV |
| Eneo la mguso wa uso wa chuma (safu ya juu) | Tin (3 - 5 µm Sn) |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Faharasa ya ufuatiliaji linganishi (IEC 60112) | CTI 175 |
| Eneo la kusugulia uso wa chuma (safu ya juu) | Tin (3 - 5 µm Sn) |
| Eneo la mguso wa uso wa chuma (safu ya kati) | Nickel (1 - 3 µm Ni) |
| Kishikilia mguso katika kiingilio Mahitaji >20 N | Test passed |
| Eneo la kusugulia uso wa chuma (safu ya kati) | Nickel (1.3 - 3 µm Ni) |
| Upinzani wa insulation, nafasi za jirani | > 5 MΩ |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (II/2) | 1.5 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/2) | 1.5 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/3) | 1.5 mm |
Maelezo ya Bidhaa
PCB headers, nominal cross section: 1.5 mm2, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 9, number of rows: 1, number o
Vipengele Muhimu
- Ubora wa kiwango cha viwanda
- Inaendana na RoHS
- Imethibitishwa CE
- Dhamana ya mwaka 1
Nyaraka za Bidhaa
Jalada la data
Speci za kiufundi na data ya utendaji
Mwongozo wa Mtumiaji
Mwongozo wa usakinishaji na uendeshaji
