

| Kipengele | Thamani |
|---|---|
| 12.3 mm Tolerance: +1.5 mm (in combination with Item family:FR 1.27/.. -PV 9.05) | |
| Hatua | 1.27 mm |
| noti | Complies with WEEE/RoHS, no thread-like materials according to IEC 60068-2-82/JEDEC JESD 201 |
| Mchakato | Reflow soldering |
| Upeo | 1.5 mm (10 Hz ... 58 Hz) |
| Kiwango cha ESD | (D) Anti-static |
| Masafa | 10 - 2000 - 10 Hz |
| Ufungashaji | Tape width 32 mm |
| Upana [w] | 17.79 mm |
| Urefu [h] | 9 mm |
| Urefu [l] | 7.2 mm |
| Mpangilio wa Pin | Linear Pad Geometry |
| Fomu ya Mshtuko | Semi-sinusoidal |
| Kasi ya Kufagia | 1 octave/min |
| Kuongeza kasi | 490 m/s² |
| Rangi (Kisanduku) | Black (9005) |
| Idadi ya nguzo | 20 |
| Jiometri ya Pedi | 0.8 x 1.1 mm |
| Aina ya Bidhaa | SMD Plug |
| Volti ya majaribio | 840 V AC IEC 60512-4-1:2003 |
| Aina ya kupachika | SMD Soldering |
| Upana wa mkanda [W] | 32 mm |
| Idadi ya safu mlalo | 2 |
| Familia ya Bidhaa | FR 1:27/.. -MV 3.25 |
| Muda wa Mshtuko | 11 ms |
| Urefu Uliopangwa kwa Mrundikano | 9.5 mm Tolerance: +1.5 mm (in combination with Item family:FR 1.27/.. -FV 6,25) |
| Kumaliza Uso | Selective Coating |
| Maelekezo ya Mtihani | X, Y and Z axis (pos. and neg.) |
| Ufikiaji wa Mawasiliano | 0.9 mm |
| Nyenzo ya Mawasiliano | Cu Alloy |
| Upinzani wa Misa | 10 mΩ |
| Imekadiriwa Sasa IN | 2.2 A IEC 60512-5-2:2002-02 (at 20 °C at 100 poles) |
| Uvumilivu wa Angular | ± 5° in longitudinal and transverse axis |
| Kipenyo cha koili [A] | 330 mm |
| Urefu wa Muunganisho | 1.5 mm |
| Aina ya kifungashio | Transparent bag |
| Mizunguko ya ujanja | 500 |
| Dokezo la Uendeshaji | The permissible voltage during operation is deduced according to the application by considering creepage and creepage distances within the scope of the insulation requirements according to IEC 60664-1. |
| Vipimo vya Mtihani | IEC 60512-5-2:2002-02 |
| Kiwango cha uchafuzi wa mazingira | 3 |
| Mchoro wa Vipimo | |
| Urefu wa Ufungaji | 8.25 mm |
| Nyenzo ya insulation | LCP |
| Upinzani wa Misa R1 | 10 mΩ |
| Upinzani wa Misa R2 | 15 mΩ |
| Kuhamisha msingi wa gurudumu | ± 0.7 mm in longitudinal and transverse axis |
| Muda wa jaribio kwa kila ekseli | 2.5 h |
| Ukubwa wa nje wa koili [W2] | 38.4 mm |
| Mizunguko ya Kuuza Upya | 3 |
| Kiwango cha Unyevu Kinachoathiriwa na Unyevu | MSL 1 |
| Kikundi cha Nyenzo za Insulation | IIIb |
| CTI kulingana na IEC 60112 | 150 |
| AWG ya sehemu mtambuka ya kondakta | (converted according to IEC) |
| Uainishaji wa Joto Tc | 260 °C |
| Halijoto ya kawaida (kuweka) | -5 °C ... 100 °C |
| Halijoto ya mazingira (inayofanya kazi) | -55 °C ... 125 °C |
| Eneo la Kuunganisha Uso wa Chuma (Safu ya Kati) | Nickel (Ni) |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Darasa la mwako kulingana na UL 94 | V0 |
| Eneo la mguso wa uso wa chuma (safu ya kati) | Nickel (Ni) |
| Unyevu wa jamaa (usafiri na uhifadhi) | 30 % ... 70 % |
| Eneo la Kuchomea Chuma Uso (Safu ya Uso) | Pond (Sn) |
| Eneo la mguso wa uso wa chuma (safu ya uso) | Gold (Au) |
| Thamani ya chini kabisa ya umbali wa hewa na uso | 0.56 mm |
| Upinzani wa Insulation Kati ya Nguzo Zilizoungana | ≥ 5 GΩ |
Speci za kiufundi na data ya utendaji
Mwongozo wa usakinishaji na uendeshaji