

| Kipengele | Thamani |
|---|---|
| Hatua | 5.08 mm |
| Matokeo | Approved Test |
| Mchakato | Reflow/Wave Soldering |
| Upeo | 0.35 mm (10 Hz ... 60.1 Hz) |
| Upana [w] | 23.12 mm |
| masafa | 10 - 150 - 10 Hz |
| Urefu [h] | 13.4 mm |
| Urefu [l] | 8.6 mm |
| Ubunifu wa Pin | Linear Pin Arrangement |
| Uchunguzi | WEEE/RoHS compliant, filament-free according to IEC 60068-2-82/JEDEC JESD 201 |
| Mizunguko ya Kuziba | 25 |
| Kasi ya kufagia | 1 octave/min |
| Kuongeza kasi | 5g (60.1 Hz ... 150 Hz) |
| Mstari wa Bidhaa | COMBICON Connectors M |
| Aina ya Bidhaa | Printed circuit board base housing |
| Kipenyo cha shimo | 1.6 mm |
| Mapitio ya Makala | 02 |
| Idadi ya safu mlalo | 1 |
| Urefu wa Jumla | 12 mm |
| Familia ya Bidhaa | CCVA 2.5/.. -G |
| Mkazo wa joto | 100 °C/168 h |
| Rangi (Nyumba) | Black (9005) |
| Idadi ya nguzo | 4 |
| Maelekezo ya Mtihani | X, Y, and Z axes |
| Nyenzo ya mawasiliano | Cu Alloy |
| Mpango wa Vipimo | |
| Idadi ya mizunguko | 25 |
| Aina ya ufungaji | THR welding/wave welding |
| Uchovu wa kutu | 0.2 dm3UNDER2in 300 dm3/40 °C/1 cycle |
| Vipimo vya Hekalu | 1 x 1 mm |
| Aina ya kifungashio | Boxed Packaging |
| Upinzani wa mguso | 1.3 mΩ |
| Mkondo wa Majina KATIKA | 12 A |
| Volti ya kawaida ya Umoja wa Mataifa | 320 V |
| Vipimo vya Mtihani | DIN EN 60512-1-1:2003-01 |
| Volti ya AC inayoweza kubebeka | 2.21 kV |
| Nyenzo za kuhami joto | LCP |
| Urefu wa Pini ya Kulehemu [P] | 1.4 mm |
| Upinzani wa Kuwasiliana R1 | 1.3 mΩ |
| Upinzani wa Kuwasiliana R2 | 1.4 mΩ |
| Nguvu ya programu-jalizi takriban. | 8 N |
| Volti ya kawaida (II/2) | 400 V |
| Idadi ya nguzo zilizojaribiwa | 24 |
| Volti ya ukubwa (III/3) | 250 V |
| Muda wa jaribio kwa kila mhimili | 2.5 h |
| Sifa za Uso | Galvanically tinned |
| Kiwango cha Unyevu Kinachoathiriwa na Unyevu | MSL 1 |
| Data kuhusu Michakato ya Kulehemu | Processing in reflow soldering processes in accordance with IEC 60068-2-58 or DIN EN 61760-1 (current version, respectively)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Kikundi cha nyenzo za kuhami joto | IIIa |
| Mizunguko ya kulehemu. kwa reflux | 3 |
| CTI kulingana na IEC 60112 | 175 |
| Volti ya vipimo (III/2) | 320 V |
| Halijoto ya Mazingira (Huduma) | -40 °C ... 100 °C (depending on the rating curve) |
| Uainishaji wa Joto Tc | 260 °C |
| Halijoto ya Mazingira (Kuweka) | -5 °C ... 100 °C |
| Volti ya muda mfupi ya nominella (II/2) | 4 kV |
| Ukubwa wa Voltage ya Insulation (II/2) | 400 V |
| Volti ya muda mfupi ya nominella (III/2) | 4 kV |
| Volti ya muda mfupi ya nominella (III/3) | 4 kV |
| Ukubwa wa Voltage ya Insulation (III/2) | 320 V |
| Ukubwa wa Voltage ya Insulation (III/3) | 250 V |
| Thamani ya chini kabisa ya mstari wa kuteleza (II/2) | 4 mm |
| Volti ya mshtuko inayoweza kubebeka katika usawa wa bahari | 4.8 kV |
| Eneo la kulehemu la uso wa chuma (safu ya juu) | Tin (3 - 5 μm Sn) |
| Thamani ya chini kabisa ya mstari wa kuteleza (III/2) | 3.2 mm |
| Thamani ya chini kabisa ya mstari wa kuteleza (III/3) | 4 mm |
| Idadi ya Pini za Solder kwa Kila Uwezo | 1 |
| Uchunguzi kuhusu operesheni | According to DIN EN 61984, COMBICON connectors are connectors without switching power (COC). In the event of use as prescribed, they must not be plugged in or unplugged under voltage or under load. |
| Kishikilia Mawasiliano KilichotumikaMahitaji >20 N | Approved Test |
| Upinzani wa Insulation Nguzo Zilizo Karibu | > 5 MΩ |
| Volti ya muda mfupi ya vipimo (II/2) | 4 kV |
| Darasa la kuwaka kulingana na UL 94 | V0 |
| Nishati inapoondolewa kwa kutumia nguzo takriban. | 6 N |
| Volti ya Muda ya Vipimo (III/2) | 4 kV |
| Volti ya muda mfupi ya vipimo (III/3) | 4 kV |
| Eneo la mguso wa uso wa chuma (safu ya juu) | Tin (3 - 5 μm Sn) |
| Halijoto ya Mazingira (Uhifadhi/Usafiri) | -40 °C ... 70 °C |
| Eneo la Kugusa Uso wa Chuma (Safu ya Kati) | Nickel (1.3 - 3 μm Ni) |
| Eneo la Kuchomea Chuma Uso (Safu ya Kati) | Nickel (1.3 - 3 μm Ni) |
| Unyevu wa hewa (uhifadhi/usafiri) | 30 % ... 70 % |
| Upinzani dhidi ya mikondo ya uvujaji (DIN EN 60112 (VDE 0303-11)) | CTI 175 |
| Thamani ya Chini Zaidi ya Umbali wa Insulation ya Hewa - Sehemu Isiyo na Sawa (II/2) | 3 mm |
| Thamani ya Chini Zaidi ya Umbali wa Kinga Hewa - Sehemu Isiyo na Uwiano (III/2) | 3 mm |
| thamani ya chini kabisa ya umbali wa insulation ya hewa - uwanja usio na usawa (III/3) | 3 mm |
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