

| Kipengele | Thamani |
|---|---|
| Dokezo | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Aina | Component suitable for through hole reflow |
| Lami | 5.08 mm |
| Kiwango cha ESD | (D) electrostatically conductive |
| Upana [w] | 50.75 mm |
| Urefu [h] | 14.6 mm |
| Urefu [l] | 8.57 mm |
| Mpangilio wa pini | Linear pinning |
| Mstari wa bidhaa | COMBICON Connectors M |
| Aina ya bidhaa | PCB headers |
| Kipenyo cha shimo | 1.6 mm |
| Aina ya kupachika | THR soldering / wave soldering |
| Vipimo | IEC 60664-1:2007-04 |
| Idadi ya safu mlalo | 1 |
| Vipimo vya pini | 1 x 1 mm |
| Familia ya bidhaa | CCV 2,5/..-GF |
| Upana wa tepi [W] | 88 mm |
| Rangi (Nyumba) | black (9005) |
| Flange ya kupachika | Threaded flange |
| Marekebisho ya makala | 06 |
| Nyenzo ya mawasiliano | Cu alloy |
| Urefu uliowekwa | 12 mm |
| Kukaza torque | 0.3 Nm |
| Aina ya kifungashio | 88 mm wide tape |
| [A] kipenyo cha koili | 330 mm |
| Mkondo wa nominella IN | 12 A |
| Volti ya kawaida ya Umoja wa Mataifa | 320 V |
| Mchoro wa vipimo | |
| Nyenzo za kuhami joto | LCP |
| Idadi ya nafasi | 8 |
| Idadi ya uwezo | 8 |
| Aina ya kifungashio cha nje | Transparent-Bag |
| Volti iliyokadiriwa (II/2) | 400 V |
| Idadi ya miunganisho | 8 |
| Volti iliyokadiriwa (III/2) | 320 V |
| Volti iliyokadiriwa (III/3) | 250 V |
| Urefu wa pini ya solder [P] | 2.6 mm |
| Sifa za uso | partially gold-plated |
| Kikundi cha nyenzo za kuhami joto | IIIa |
| Pini za solder kwa kila uwezo | 1 |
| CTI kulingana na IEC 60112 | 175 |
| Volti ya kuongezeka iliyokadiriwa (II/2) | 4 kV |
| Volti ya kuongezeka iliyokadiriwa (III/2) | 4 kV |
| Volti ya kuongezeka iliyokadiriwa (III/3) | 4 kV |
| Kipimo cha jumla cha koili ya [W2] | 94.4 mm |
| Halijoto ya kawaida (mkusanyiko) | -5 °C ... 100 °C |
| Halijoto ya mazingira (uendeshaji) | -40 °C ... 100 °C (dependent on the derating curve) |
| Maelezo ya michakato ya kutengenezea | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Volti ya insulation iliyokadiriwa (II/2) | 400 V |
| Volti ya insulation iliyokadiriwa (III/2) | 320 V |
| Volti ya insulation iliyokadiriwa (III/3) | 250 V |
| umbali wa chini kabisa wa kuteleza (II/2) | 4 mm |
| umbali wa chini kabisa (III/2) | 3.2 mm |
| umbali wa chini kabisa (III/3) | 4 mm |
| Unyevu wa jamaa (uhifadhi/usafiri) | 30 % ... 70 % |
| Ukadiriaji wa kuwaka kulingana na UL 94 | V0 |
| Eneo la mguso wa uso wa chuma (safu ya juu) | Gold (0.8 - 1.4 µm Au) |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Faharasa ya ufuatiliaji linganishi (IEC 60112) | CTI 175 |
| Eneo la kusugulia uso wa chuma (safu ya juu) | Tin (5 - 7 µm Sn) |
| Eneo la mguso wa uso wa chuma (safu ya kati) | Nickel (2 - 4 µm Ni) |
| Eneo la kusugulia uso wa chuma (safu ya kati) | Nickel (2 - 4 µm Ni) |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (II/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/3) | 3 mm |
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