Kipatikana Bidhaa Maarufu
CC 2,5/ 5-GF-5,08 P26THR AU
CC 2,5/ 5-GF-5,08 P26THR AU 1749175 PHOENIX CONTACT Printed-circuit board connector
$0.00USD
3381 kwenye hisa
Vipimo Muhimu
Dokezo:WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Aina:Component suitable for through hole reflow
Lami:5.08 mm
Matokeo:Test passed
Taarifa za Msambazaji
Bidhaa: 0
Kwa kawaida husafirisha ndani ya siku 2-3 za kazi
Ubora Umeheshimiwa
Usafirishaji wa haraka
Msaada wa Kiufundi
Speci ya Kiufundi
| Kipengele | Thamani |
|---|---|
| Dokezo | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Aina | Component suitable for through hole reflow |
| Lami | 5.08 mm |
| Matokeo | Test passed |
| Mchakato | Reflow/wave soldering |
| Upeo | 0.35 mm (10 Hz ... 60.1 Hz) |
| Masafa | 10 - 500 - 10 Hz |
| Upana [w] | 45.72 mm |
| Urefu [h] | 11.2 mm |
| Urefu [l] | 12 mm |
| Mpangilio wa pini | Linear pinning |
| Nafasi ya kubandika | 5.08 mm |
| Umbo la mapigo | Semi-sinusoidal |
| Kasi ya kufagia | 1 octave/min |
| Kuongeza kasi | 5g (60.1 Hz ... 500 Hz) |
| Mstari wa bidhaa | COMBICON Connectors M |
| Aina ya bidhaa | PCB headers |
| Kipenyo cha shimo | 1.6 mm |
| Aina ya kupachika | THR soldering / wave soldering |
| Idadi ya mizunguko | 100 |
| Vipimo | IEC 60512-1-1:2002-02 |
| Idadi ya safu mlalo | 1 |
| Vipimo vya pini | 1 x 1 mm |
| Familia ya bidhaa | CC 2,5/..-GF |
| Muda wa mshtuko | 18 ms |
| Mkazo wa joto | 100 °C/168 h |
| Rangi (Nyumba) | black (9005) |
| Flange ya kupachika | Threaded flange |
| Maelekezo ya majaribio | X-, Y- and Z-axis |
| Marekebisho ya makala | 03 |
| Nyenzo ya mawasiliano | Cu alloy |
| Mkazo unaosababisha kutu | 1.0 dm3SO2on 300 dm3/40 °C/3 cycles |
| Urefu uliowekwa | 8.6 mm |
| Kukaza torque | 0.3 Nm |
| Aina ya kifungashio | packed in cardboard |
| Upinzani wa mguso | 1.8 mΩ |
| Mkondo wa nominella IN | 12 A |
| Volti ya kawaida ya Umoja wa Mataifa | 320 V |
| Mchoro wa vipimo | |
| Nyenzo za kuhami joto | LCP |
| Idadi ya nafasi | 5 |
| Volti iliyokadiriwa (II/2) | 400 V |
| Upinzani wa mguso R1 | 1.8 mΩ |
| Upinzani wa mguso R2 | 2 mΩ |
| Volti iliyokadiriwa (III/2) | 320 V |
| Volti iliyokadiriwa (III/3) | 250 V |
| Urefu wa pini ya solder [P] | 2.6 mm |
| Muda wa jaribio kwa kila mhimili | 2 h |
| Sifa za uso | partially gold-plated |
| Kiwango cha Unyevu Kinachoathiriwa na Unyevu | MSL 1 |
| Kikundi cha nyenzo za kuhami joto | IIIa |
| Pini za solder kwa kila uwezo | 1 |
| CTI kulingana na IEC 60112 | 175 |
| Volti ya kuongezeka iliyokadiriwa (II/2) | 4 kV |
| Idadi ya nafasi zilizojaribiwa | 12 |
| Mizunguko ya kuingiza/kutoa | 100 |
| Volti ya kuongezeka iliyokadiriwa (III/2) | 4 kV |
| Volti ya kuongezeka iliyokadiriwa (III/3) | 4 kV |
| Mizunguko ya solder katika mtiririko mpya | 3 |
| Uainishaji wa halijoto Tc | 260 °C |
| Halijoto ya kawaida (mkusanyiko) | -5 °C ... 100 °C |
| Halijoto ya mazingira (uendeshaji) | -40 °C ... 100 °C (dependent on the derating curve) |
| Maelezo ya michakato ya kutengenezea | Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Volti ya insulation iliyokadiriwa (II/2) | 400 V |
| Volti ya insulation iliyokadiriwa (III/2) | 320 V |
| Volti ya insulation iliyokadiriwa (III/3) | 250 V |
| umbali wa chini kabisa wa kuteleza (II/2) | 4 mm |
| Volti inayostahimili masafa ya nguvu | 2.21 kV |
| umbali wa chini kabisa (III/2) | 3.2 mm |
| umbali wa chini kabisa (III/3) | 4 mm |
| Punguza nguvu kwa kila pos. takriban. | 5 N |
| Nguvu ya kuingiza kwa kila nafasi ni takriban. | 6.5 N |
| Unyevu wa jamaa (uhifadhi/usafiri) | 30 % ... 70 % |
| Ukadiriaji wa kuwaka kulingana na UL 94 | V0 |
| Msukumo hustahimili volteji katika usawa wa bahari | 4.8 kV |
| Eneo la mguso wa uso wa chuma (safu ya juu) | Gold (0.8 - 1.4 µm Au) |
| Halijoto ya kawaida (uhifadhi/usafiri) | -40 °C ... 70 °C |
| Faharasa ya ufuatiliaji linganishi (IEC 60112) | CTI 175 |
| Eneo la kusugulia uso wa chuma (safu ya juu) | Tin (3 - 5 µm Sn) |
| Eneo la mguso wa uso wa chuma (safu ya kati) | Nickel (2 - 3 µm Ni) |
| Kishikilia mguso katika kiingilio Mahitaji >20 N | Test passed |
| Eneo la kusugulia uso wa chuma (safu ya kati) | Nickel (1 - 3 µm Ni) |
| Upinzani wa insulation, nafasi za jirani | >1012Ω |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (II/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/2) | 3 mm |
| thamani ya chini kabisa ya kibali - uwanja usio na usawa (III/3) | 3 mm |
Maelezo ya Bidhaa
Printed circuit board base housing, nominal section: 2.5 mm², color: black, nominal current: 12 A, nominal voltage (III/2): 320 V, contact surface: Gold, contact type: Male, number of rows: 1, number
Vipengele Muhimu
- Ubora wa kiwango cha viwanda
- Inaendana na RoHS
- Imethibitishwa CE
- Dhamana ya mwaka 1
Nyaraka za Bidhaa
Jalada la data
Speci za kiufundi na data ya utendaji
Mwongozo wa Mtumiaji
Mwongozo wa usakinishaji na uendeshaji
