

| Kipengele | Thamani |
|---|---|
| Soldering on D-SUB housing | |
| Upana | 22.5 mm |
| Kulinda | Plastic-coated aluminum foil, tinned copper braided shield |
| Urefu wa kebo | 0.6 m |
| Upinzani wa kebo | ≤ 260 Ω/km |
| Mbinu ya muunganisho | RJ45 |
| Nyenzo ya kondakta | Bare Cu litz wires |
| Sehemu ya msalaba wa kebo | 0.48 mm² (AWG 26) |
| Idadi ya nafasi | 15 |
| Ala ya nje, nyenzo | LSHF (FRNC) |
| Halijoto ya mazingira (uendeshaji) | -20 °C ... 60 °C (for fixed installation) |
| Halijoto ya kawaida (uhifadhi/usafiri) | -20 °C ... 70 °C |
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